Srivalli Chellvarajoo

Microstructure and mechanical properties of Pb-free Sn–3.0Ag–0.5Cu solder pastes added with NiO nanoparticles after reflow soldering process

Srivalli Chellvarajoo, M.Z. Abdullah · Materials & Design · 2015 · 76 citations · Full text

Materials Science, Engineering, Powder Metallurgy +7

Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

Srivalli Chellvarajoo, M.Z. Abdullah, Zambri Samsudin · Materials & Design (1980-2015) · 2014 · 69 citations

Materials Science, Magnetic Properties, Engineering +9

Effects of diamond nanoparticles reinforcement into lead-free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

Srivalli Chellvarajoo, M.Z. Abdullah, C. Y. Khor · Materials & Design · 2015 · 58 citations · Full text

Materials Science, Diamond-like Carbon, Engineering +7

Stencil printing process performance on various aperture size and optimization for lead-free solder paste

Mohd Syakirin Rusdi, M.Z. Abdullah, Srivalli Chellvarajoo et al. · The International Journal of Advanced Manufacturing Technology · 2019 · 25 citations

Materials Science, Engineering, Various Aperture Size +2

Investigation on nano-reinforced solder paste after reflow soldering part 1: Effects of nano-reinforced solder paste on melting, hardness, spreading rate, and wetting quality

Srivalli Chellvarajoo, M.Z. Abdullah · Microelectronics Reliability · 2018 · 15 citations

Materials Science, Part 1, Engineering +4