Zambri Samsudin

Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

Srivalli Chellvarajoo, M.Z. Abdullah, Zambri Samsudin · Materials & Design (1980-2015) · 2014 · 69 citations

Materials Science, Magnetic Properties, Engineering +9

Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation

Muhamad Zamri Yahaya, Fakhrozi Che Ani, Zambri Samsudin et al. · Materials Science and Engineering A · 2016 · 36 citations

Materials Engineering, Materials Science, Engineering +5

Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering

M.Z. Abdullah, Abdullah Aziz Saad, Zambri Samsudin et al. · Microelectronics Reliability · 2017 · 35 citations

Materials Science, Chip Resistor Components, Engineering +9

Wearable strain sensors: design shapes, fabrication, encapsulation and performance evaluation methods

Nur Nazihah Abu Hassan Zahri, Anis Nurashikin Nordin, Norsinnira Zainul Azlan et al. · Sensors & Diagnostics · 2024 · 20 citations · Full text

Wearable System, Engineering, Mechanical Engineering +19

A novel analytical filling time chart for design optimization of flip-chip underfill encapsulation process

Fei Chong Ng, M. Yusuf Tura Ali, Aizat Abas et al. · The International Journal of Advanced Manufacturing Technology · 2019 · 18 citations

Physical Design (Electronics), Chip-scale Package, Engineering +6