Fakhrozi Che Ani

Three-dimensional numerical and experimental investigations on polymer rheology in meso-scale injection molding

C. Y. Khor, Zulkifli Mohamad Ariff, Fakhrozi Che Ani et al. · International Communications in Heat and Mass Transfer · 2009 · 57 citations

Engineering, Materials Engineering, Materials Science +16

FVM based numerical study on the effect of solder bump arrangement on capillary driven flip chip underfill process

C. Y. Khor, M.Z. Abdullah, M. Abdul Mujeebu et al. · International Communications in Heat and Mass Transfer · 2009 · 51 citations

Engineering, Materials Engineering, Materials Science +11

CFD modeling of pin shape effects on capillary flow during wave soldering

Mohd Sharizal Abdul Aziz, M.Z. Abdullah, C. Y. Khor et al. · International Journal of Heat and Mass Transfer · 2014 · 51 citations

Engineering, Computational Engineering, Materials Engineering +16

Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process

Chun‐Sean Lau, M.Z. Abdullah, Fakhrozi Che Ani · Soldering and Surface Mount Technology · 2012 · 47 citations

Engineering, Materials Engineering, Mechanical Engineering +17

Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach

Mohd Sharizal Abdul Aziz, M.Z. Abdullah, C. Y. Khor et al. · International Communications in Heat and Mass Transfer · 2013 · 42 citations

Engineering, Materials Engineering, Computational Fluid Dynamics +4