Ernest E.S. Ong

The temperature-dependent structure, hydrogen bonding and other related dynamic properties of the standard TIP3P and CHARMM-modified TIP3P water models

Ernest E.S. Ong, Jong‐Leng Liow · Fluid Phase Equilibria · 2018 · 78 citations · Full text

Materials Science, Engineering, Physicochemical Analysis +8

Yield stress measurement of a thixotropic colloid

Ernest E.S. Ong, Sean O’Byrne, Jong‐Leng Liow · Rheologica Acta · 2019 · 38 citations · Full text

Materials Science, Colloidal Material, Thixotropy +6

Analysis of encapsulation process in 3D stacked chips with different microbump array

Ernest E.S. Ong, M.Z. Abdullah, C. Y. Khor et al. · International Communications in Heat and Mass Transfer · 2012 · 34 citations

Materials Science, 3D Ic Architecture, Chip-scale Package +13

Fluid–structure interaction analysis on the effect of chip stacking in a 3D integrated circuit package with through-silicon vias during plastic encapsulation

Ernest E.S. Ong, M.Z. Abdullah, C. Y. Khor et al. · Microelectronic Engineering · 2013 · 34 citations

3D Ic Architecture, Chip-scale Package, Engineering +12

Study on the Fluid–Structure Interaction of Flexible Printed Circuit Board Electronics in the Flow Environment

W.C. Leong, M.Z. Abdullah, C. Y. Khor et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 12 citations

Engineering, Flow Environment, Fluid Mechanics +18