Concepedia

S.-J. Hwang

SH

2

Publications

117

Citations

2

H-Index

2004

Active since

Affiliations

National Cheng Kung University(Current)

S.-J. Hwang is an author at National Cheng Kung University specializing in electronic packaging, engineering, and mechanical engineering.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMechanical EngineeringPlasticity3D PrintingSoft MatterSolid MechanicsMicroelectronicsMicrofabrication

Publications per year

2004–2004

2

Publications

2

Three-Dimensional Modeling of Mold Filling in Microelectronics Encapsulation Process

R. Y. Chang, Wenli Yang, S.-J. Hwang et al. · IEEE Transactions on Components and Packaging Technologies · 2004 · 73 citations

Engineering, Mechanical Engineering, Advanced Manufacturing +17

Study of Warpage Due to P-V-T-C Relation of EMC in IC Packaging

Li-Ching Hong, S.-J. Hwang · IEEE Transactions on Components and Packaging Technologies · 2004 · 44 citations

Engineering, Mechanical Engineering, Encapsulation Material +22

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