IEEE Transactions on Electron Devices · 2012 · 25 citations · 10 references
EngineeringElectrical EngineeringMicroelectronicsPower ElectronicsSemiconductor DevicesDevice CharacterizationDevice ModelingDevice SimulationElectronics TechnologyIntegrated Circuit DevicesSemiconductor PhysicsCircuit SimulationCompact Device ModelingCompact ModelingInsulated-gate Field-effect TransistorsPhysics-based Device ModelingPower Device SimulationPunch-throughSemiconductor Device Modeling
This paper presents a compact model of SiC insulated-gate bipolar transistors (IGBTs) for power electronic circuit simulation. Here, we focus on the modeling of important specific features in the turn-off characteristics of the 4H-SiC IGBT, which are investigated with a 2-D device simulator, at supply voltages higher than 5 kV. These features are found to originate from the punch-through effect of the SiC IGBT. Thus, they are modeled based on the carrier distribution change caused by punch through and implemented into the silicon IGBT model named “HiSIM-IGBT” to obtain a practically useful SiC-IGBT model. The developed compact SiC-IGBT model for circuit simulation is verified with the 2-D device simulation data.
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SiC Power Devices for Microgrids
Qingchun Zhang, Robert Callanan, Mrinal K. Das et al. · IEEE Transactions on Power Electronics · 2010 · 175 citations
Ultra high voltage (>12 kV), high performance 4H-SiC IGBTs
Sei‐Hyung Ryu, Craig Capell, Charlotte Jonas et al. · 2012 · 71 citations