Relationship between microstructure and electromigration damage in unpassivated PVD copper damascene interconnects

Electromigration path in Cu thin-film lines

C.‐K. Hu, R. Rosenberg, K. Y. Lee · Applied Physics Letters · 1999 · 325 citations

Engineering, Interconnect (Integrated Circuits), Surface Transport +16

Copper interconnections and reliability

C.‐K. Hu, J. M. E. Harper · Materials Chemistry and Physics · 1998 · 280 citations

Reliability, Electrical Engineering, Reliability Engineering +8

Electromigration in copper conductors

J. R. Lloyd, J. J. Clement · Thin Solid Films · 1995 · 231 citations

Electrical Engineering, Electromigration Technique, Engineering +3

Microstructure and reliability of copper interconnects

Changsup Ryu, Kee-Won Kwon, Alvin L. S. Loke et al. · IEEE Transactions on Electron Devices · 1999 · 185 citations

Engineering, Cvd Cu, Chemical Deposition +17

Texture analysis of damascene-fabricated Cu lines by x-ray diffraction and electron backscatter diffraction and its impact on electromigration performance

Linda Vanasupa, Young‐Chang Joo, Paul R. Besser et al. · Journal of Applied Physics · 1999 · 107 citations

Engineering, Tin Barrier Layers, Damascene-fabricated Cu Lines +19