Applied Physics Express · 2015 · 12 citations · 20 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsCurrent-voltage CharacteristicsDevice CharacterizationDopingField-effect TransistorsIntegrated Circuit DesignWide Band Gap SemiconductorsField-effect Transistor Transfer CharacteristicsGate Dielectric EngineeringGate DielectricsGate Oxide LeakageGate-dependent Current-voltage BehaviorHeterostructure Field-effect TransistorsPlasma TreatmentThreshold Voltage
Enhancement-mode AlInN/GaN metal–insulator–semiconductor heterostructure field-effect transistors on silicon are reported. A fluorine-based plasma treatment and gate dielectric are employed, and the devices exhibit a threshold voltage of +3 V. A drain current density of 295 mA/mm for a gate bias of +10 V is measured. An excellent off-state blocking voltage capability of 630 V for a leakage current of 1 µA/mm, and over 1000 V for 10 µA/mm are achieved on a 20-µm-gate–drain separation device at gate bias of 0 V. The dynamic on-resistance is ~2.2 times the DC on-resistance when pulsing from an off-state drain bias of 500 V.
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