Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1998 · 30 citations · 6 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsDopingHigh-frequency Semiconductor DevicesMetal-oxide-semiconductor Field-effect TransistorsMicrowave Semiconductor DevicesSemiconductor Device MaterialsWide Band Gap SemiconductorsCurrent DensityDepletion-mode TransistorsGaas Microwave Integrated CircuitsGate Oxide InterfacesMetal-semiconductor Field-effect TransistorsMicrowave DevicesMolecular Beam EpitaxyTransconductance
We have successfully fabricated depletion mode GaAs metal–oxide–semiconductor field effect transistors using Ga2O3(Gd2O3) as the gate oxide and an oxygen implant isolation technique. Growth of the device structure including the deposition of Ga2O3(Gd2O3) was performed in a multichamber molecular beam epitaxy system. A 1 μm×100 μm device shows excellent dc and microwave characteristics with low output conductance. Complete pinchoff at Vg=−2.5 V and operation in the accumulation mode of up to Vg=2.5 V were measured. The maximum transconductance was 100 mS/mm, with a high drain current density of 315 mA/mm. Microwave testing yielded a fT of 14 GHz and a fmax of 35 GHz.
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Hideki Hasegawa, Hirotatsu Ishii, T. Sawada et al. · Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena · 1988 · 86 citations
Natural Sciences, Materials Engineering, Materials Science +17
Wet Chemical and Plasma Etching of Ga2 O 3 ( Gd2 O 3 )
F. Ren, Minghui Hong, J. P. Mannáerts et al. · Journal of The Electrochemical Society · 1997 · 34 citations