Designing for reliability using a new Wafer Level Package structure

Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints

A. Syed · 2004 · 353 citations

Engineering, Materials Engineering, Materials Science +17

Wafer level chip scale packaging (WL-CSP): an overview

P. Garrou · IEEE Transactions on Advanced Packaging · 2000 · 183 citations

Engineering, Computer Engineering, Microfabrication +13

Constitutive behaviour of lead-free solders vs. lead-containing solders-experiments on bulk specimens and flip-chip joints

Steffen Wiese, Andreas Schubert, H. Walter et al. · 2001 · 133 citations

Natural Sciences, Materials Engineering, Materials Science +14

Drop Impact: Fundamentals and Impact Characterisation of Solder Joints

E.H. Wong, R. Rajoo, S.K.W. Seah et al. · 2005 · 84 citations

Engineering, Materials Engineering, Materials Science +17

Modeling and analysis of 96.5Sn-3.5Ag lead-free solder joints of wafer level chip scale package on buildup microvia printed circuit board

John H. Lau, S. W. Ricky Lee · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 66 citations

Natural Sciences, Materials Engineering, Materials Science +17