Concepedia
Statistics
Publications
2
Citations
54
H-Index
Active since
2008
Affiliations
NXP (Netherlands)(Current)
Delft University of Technology
P. Hochstenbach is an author at NXP (Netherlands) specializing in engineering, packaging engineering, and wafer bonding.
Publications per year
2008–2009
Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP
Fenglian Sun, P. Hochstenbach, W.D. van Driel et al. · Microelectronics Reliability · 2008 · 42 citations
Engineering, Materials Engineering, Materials Science +13
Designing for reliability using a new Wafer Level Package structure
P. Hochstenbach, W.D. van Driel, Daoguo Yang et al. · Microelectronics Reliability · 2009 · 12 citations
Engineering, Systems Engineering, Packaging Design +9
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