IEEE Electron Device Letters · 2015 · 60 citations · 15 references
Wide-bandgap SemiconductorHigh-temperature Gate RecessEngineeringMis-hemts FabricatedSemiconductorsElectronic DevicesRf SemiconductorNanoelectronicsDry EtchingWide-bandgap SemiconductorsMaterials EngineeringSemiconductor TechnologyElectrical EngineeringCrystalline DefectsAluminum Gallium NitrideMicroelectronicsHigh-temperature Gate-recess TechniqueApplied PhysicsAlgan BarrierGan Power Device
In this letter, we report high-performance enhancement-mode (E-mode) Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> /AlGaN/GaN metal–insulator–semiconductor high-electron-mobility transistors (MIS-HEMTs) fabricated with high-temperature low-damage gate recess technique. The high-temperature gate recess is implemented by increasing the substrate temperature to 180 °C to enhance the desorption of chlorine-based etching residues during the dry etching of AlGaN barrier. High-crystal-quality Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> gate dielectric was grown by atomic-layer deposition using O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> as the oxygen source to suppress hydrogen-induced weak bonds. The fabricated E-mode MIS-HEMTs exhibit a threshold voltage of 1.6 V, a pulsed drive current of 1.13 A/mm, and very low OFF-state standby power of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$6.8 \times 10^{\mathrm {-8}}$ </tex-math></inline-formula> W/mm at <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$V_{\mathrm {GS}} =0$ </tex-math></inline-formula> V and <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$V_{\mathrm {DS}} =30$ </tex-math></inline-formula> V. At 4 GHz and in pulse-mode operation, the output power density and power-added efficiency were measured to be 5.76 W/mm and 57%, both of which are the highest for GaN-based E-mode MIS-HEMTs reported to date.
15
GaN: Processing, defects, and devices
S. J. Pearton, J.C. Zolper, R. J. Shul et al. · Journal of Applied Physics · 1999 · 1.8K citations
Wide-bandgap Semiconductor, Electrical Engineering, Point Defects +11
Wataru Saito, Yoshiharu Takada, Masahiko Kuraguchi et al. · IEEE Transactions on Electron Devices · 2006 · 550 citations
Wide-bandgap Semiconductor, Electrical Engineering, Engineering +15
Yong Cai, Yugang Zhou, Kei May Lau et al. · IEEE Transactions on Electron Devices · 2006 · 518 citations
Wide-bandgap Semiconductor, Semiconductor Technology, Electrical Engineering +12