Concepedia

Packaging Failures

Packaging Failures is a phenomenon in supply chain logistics wherein protective enclosures for goods are unable to fulfill their intended functions during transit, storage, or handling, leading to product damage, contamination, or non-compliance with regulatory or customer requirements.

52

Publications

2.5K

Citations

237

Authors

64

Institutions

Publications per year

2017–2026

6

Parents

Publications

52

In Situ Diagnostics and Prognostics of Wire Bonding Faults in IGBT Modules for Electric Vehicle Drives

Bing Ji, Volker Pickert, Wenping Cao et al. · IEEE Transactions on Power Electronics · 2013 · 324 citations · Full text

, , +17

Analysis of Package Cracking During Reflow Soldering Process

Makoto Kitano, A. Nishimura, Sueo KAWAI et al. · Reliability physics · 1988 · 181 citations

, , +9

Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition

Yi‐Shao Lai, Ping‐Feng Yang, Chang-Lin Yeh · Microelectronics Reliability · 2005 · 180 citations

, , +14

Failure modes and FEM analysis of power electronic packaging

Hua Ye, Minghui Lin, Cemal Basaran · Finite Elements in Analysis and Design · 2002 · 162 citations

, , +16

Analysis of package cracking during reflow soldering process

Masaharu Kitano, A. Nishimura, Sueo KAWAI et al. · 2003 · 115 citations

, , +9

1–5 of 52

Authors

237

  1. CY
    Chang-Lin Yeh

    Advanced Semiconductor Engineering (Taiwan), Taiwan

    5 publications · 346 citations

    5

    h-index

  2. YL
    Yi‐Shao Lai

    Advanced Semiconductor Engineering (Taiwan), Taiwan

    5 publications · 346 citations

    5

    h-index

  3. KN
    Kunihiko NISHI

    Hitachi (Japan), Japan

    2 publications · 296 citations

    2

    h-index

  4. DP
    Dhananjay Panchagade

    Auburn University, United States

    2 publications · 152 citations

    2

    h-index

  5. AN
    A. Nishimura

    Hitachi (Japan), Japan

    2 publications · 296 citations

    2

    h-index

1–5 of 237

Institutions

64

  1. Advanced Semiconductor Engineering (Taiwan)

    Kaohsiung, Taiwan

    5 h-index

    15 publications

    1K citations

  2. Texas Instruments (United States)

    Dallas, United States

    3 h-index

    7 publications

    133 citations

  3. University of Maryland, College Park

    College Park, United States

    3 h-index

    5 publications

    132 citations

  4. Hitachi (Japan)

    Tokyo, Japan

    2 h-index

    8 publications

    1.2K citations

  5. University College Cork

    Cork, Ireland

    2 h-index

    5 publications

    95 citations

  6. Korea Aerospace Research Institute

    Daejeon, South Korea

    2 h-index

    2 publications

    58 citations

  7. Philips (Netherlands)

    Amsterdam, The Netherlands

    2 h-index

    4 publications

    100 citations

  8. Danfoss (Denmark)

    Nordborg, Denmark

    2 h-index

    4 publications

    121 citations

1–8 of 64

Venues

  1. Microelectronics Reliability

    24 publications · 893 citations

    17

    h-index

  2. 2

    h-index

  3. Bell System Technical Journal

    BSTJ · 1 publications · 100 citations

    1

    h-index

  4. International Journal of Dairy Technology

    1 publications · 20 citations

    1

    h-index

  5. IEEE Transactions on Power Electronics

    1 publications · 324 citations

    1

    h-index

1–5