Yeong K. Kim - Concepedia

Author

Yeong K. Kim

University of Illinois Urbana-Champaign

Also Known As

Yeong K. Kim

Publications

778

Citations

H-Index

Concepts

All Affiliations

University of Illinois Urbana-Champaign Inha University Korea Aerospace University Korea Aerospace Research Institute

About

Yeong K. Kim is an author at University of Illinois Urbana-Champaign specializing in engineering, mechanics of materials, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	10	10	743
2	Materials Science	5	5	604
3	Mechanical Engineering	5	5	582
4	Electrical Engineering	3	3	87
5	Industrial Engineering	1	1	32

Yeong K. Kim

Publications

743

Citations

H-Index

Page 1

	Year	Citations
Stress relaxation behavior of 3501‐6 epoxy resin during cure Yeong K. Kim, Scott R. White Polymer Engineering and Science EngineeringMechanical EngineeringStress Relaxation TimesThermoplastic CompositeGlass Transition	1996	227
PROCESS-INDUCED RESIDUAL STRESS ANALYSIS OF AS4/3501-6 COMPOSITE MATERIAL Scott R. White, Yeong K. Kim Mechanics of Advanced Materials and Structures Materials ScienceEngineeringMechanical EngineeringProcess-induced Residual StressesCure Cycle	1998	193
VISCOELASTIC ANALYSIS OF PROCESSING-INDUCED RESIDUAL STRESSES IN THICK COMPOSITE LAMINATES Yeong K. Kim, Scott R. White Mechanics of Advanced Materials and Structures Materials ScienceFibre-reinforced PlasticEngineeringThick Composite LaminatesMechanics	1997	109
Process-Induced Stress Relaxation Analysis of AS4/3501-6 Laminate Yeong K. Kim, Scott R. White Journal of Reinforced Plastics and Composites Materials ScienceFinite Element MethodEngineeringAs4/3501-6 LaminateMechanical Properties	1997	54
PBGA packaging reliability assessments under random vibrations for space applications Yeong K. Kim, Do Soon Hwang Microelectronics Reliability ReliabilityElectrical EngineeringReliability EngineeringEngineeringChip-scale Package	2014	38
Butt-welding technology for double walled Polyethylene pipe Boyoung Lee, Jae-Seong Kim, Sang-Yul Lee, Materials & Design (1980-2015) EngineeringWelding ProcessIndustrial EngineeringMechanical EngineeringPressure Vessel	2011	32
Warpage mechanism analyses of strip panel type PBGA chip packaging Yeong K. Kim, Joo-Ho Choi Microelectronics Reliability Electrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Chip On Board	2010	30
Viscoelastic Effect of FR-4 Material on Packaging Stress Development Yeong K. Kim IEEE Transactions on Advanced Packaging Materials SciencePackaging Stress DevelopmentFibre-reinforced PlasticEngineeringMechanical Behavior	2007	21
Module packaging effects on MEMS airbag sensor performance for automobiles Dong Hyun Park, Sojin Shin, Yeong K. Kim Microelectronics Reliability Advanced PackagingEngineeringAerospace EngineeringModule Packaging EffectsElectronic Packaging	2017	20
Analyses on the large size PBGA packaging reliability under random vibrations for space applications Yeong K. Kim, Seok-min Lee, Do‐Soon Hwang, Microelectronics Reliability ReliabilityElectrical EngineeringReliability EngineeringEngineeringChip-scale Package	2020	19

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