Minghui Lin

Statistics

Publications

Citations

583

H-Index

Active since

2002

Affiliations

University at Buffalo, State University of New York(Current)

Beihang University

Minghui Lin is an author at University at Buffalo, State University of New York specializing in engineering, mechanics of materials, and electronic packaging.

Top concepts

EngineeringElectronic PackagingMechanics Of MaterialsSolid MechanicsMaterial ScienceMicroelectronicsElectrical EngineeringMechanical EngineeringMechanicsElectrical Insulation

Publications per year

2002–2022

Publications

Failure modes and FEM analysis of power electronic packaging

Hua Ye, Minghui Lin, Cemal Basaran · Finite Elements in Analysis and Design · 2002 · 160 citations

Reliability, Electrical Engineering, Reliability Engineering +7

A thermodynamic model for electrical current induced damage

Cemal Basaran, Minghui Lin, Hua Ye · International Journal of Solids and Structures · 2003 · 115 citations

Electrical Engineering, Damage Mechanism, Engineering +9

Damage mechanics of electromigration induced failure

Cemal Basaran, Minghui Lin · Mechanics of Materials · 2007 · 84 citations

Electromigration Technique, Reliability Engineering, Engineering +8

Electromigration induced stress analysis using fully coupled mechanical–diffusion equations with nonlinear material properties

Minghui Lin, Cemal Basaran · Computational Materials Science · 2004 · 59 citations

Materials Science, Electromigration Technique, Nonlinear Elasticity +12

Damage mechanics of electromigration in microelectronics copper interconnects

Cemal Basaran, Minghui Lin · International Journal of Materials and Structural Integrity · 2007 · 38 citations

Engineering, Interconnect (Integrated Circuits), Nanoelectronics +16

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