Concepedia

Package Warpage Control

Package Warpage Control is a methodological framework within MEMS packaging that specifically addresses the mitigation and management of thermomechanical deformation during fabrication and operation by regulating material anisotropy, residual stress, and coefficient of thermal expansion mismatches to ensure structural integrity and dimensional stability.

47

Publications

1.3K

Citations

242

Authors

57

Institutions

Publications per year

2017–2026

20

Parents

Publications

47

Wafer Warpage Experiments and Simulation for Fan-Out Chip on Substrate

Yuan-Ting Lin, Wei‐Hong Lai, Chin‐Li Kao et al. · 2016 · 88 citations

, , +13

Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package

Fengze Hou, Tingyu Lin, Liqiang Cao et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 75 citations

, , +15

Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging

Tz-Cheng Chiu, En-Yu Yeh · Microelectronics Reliability · 2017 · 66 citations

, , +16

Warpage characterization of panel Fan-out (P-FO) package

Hung‐wen Liu, Yiwei Liu, Jason Ji et al. · 2014 · 62 citations

, , +13

Application of through mold via (TMV) as PoP base package

Jinseong Kim, Kiwook Lee, Dongjoo Park et al. · 2008 · 54 citations

, , +13

1–5 of 47

Authors

242

  1. XF
    Xuejun Fan

    Lamar University, United States

    3 publications · 119 citations

    3

    h-index

  2. XC
    Xi Cao

    ASM Pacific Technology (China), China

    2 publications · 59 citations

    2

    h-index

  3. RS
    Richard Strode

    Micron (United States), United States

    2 publications · 28 citations

    2

    h-index

  4. RA
    Ravikumar Adimula

    Micron (United States), United States

    2 publications · 28 citations

    2

    h-index

  5. NV
    Niranjan Vijayaragavan

    STATS ChipPAC (Singapore), Singapore

    2 publications · 55 citations

    2

    h-index

1–5 of 242

Institutions

57

  1. Amkor Technology (United States)

    Tempe, United States

    4 h-index

    23 publications

    984 citations

  2. Chinese Academy of Sciences

    Beijing, China

    3 h-index

    12 publications

    610 citations

  3. Georgia Institute of Technology

    Atlanta, United States

    3 h-index

    11 publications

    178 citations

  4. Industrial Technology Research Institute

    Hsinchu, Taiwan

    3 h-index

    22 publications

    490 citations

  5. Lamar University

    Beaumont, United States

    3 h-index

    6 publications

    190 citations

  6. Samsung (South Korea)

    Seoul, South Korea

    3 h-index

    12 publications

    284 citations

  7. Advanced Semiconductor Engineering (Taiwan)

    Kaohsiung, Taiwan

    3 h-index

    13 publications

    712 citations

  8. Huawei Technologies (China)

    Shenzhen, China

    2 h-index

    4 publications

    118 citations

1–8 of 57

Venues

  1. 8

    h-index

  2. Microelectronics Reliability

    5 publications · 195 citations

    5

    h-index

  3. IMAPSource Proceedings

    1 publications · 11 citations

    1

    h-index

  4. 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

    Conference · 1 publications · 21 citations

    1

    h-index

  5. Microelectronic Engineering

    1 publications · 12 citations

    1

    h-index

1–5