Statistics
Publications
2
Citations
28
H-Index
2
Active since
2010
Affiliations
Micron (United States)(Current)
Richard Strode is an author at Micron (United States) specializing in package warpage control, mechanical behavior of materials, and packaging materials.
Publications per year
2010–2011
2
2
Effects of material properties on PoP top package warpage behaviors
Myung Jin Yim, Richard Strode, Ravikumar Adimula et al. · 2010 · 18 citations
Ultra thin PoP top package using compression mold: Its warpage control
Myung Jin Yim, Richard Strode, Jason M. Brand et al. · 2011 · 10 citations
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