Statistics
Publications
1
Citations
10
H-Index
1
Active since
2011
Affiliations
Micron (United States)(Current)
Jason M. Brand is an author at Micron (United States) specializing in package warpage, packaging materials, and packaging design.
Publications per year
2011–2011
1
1
Ultra thin PoP top package using compression mold: Its warpage control
Myung Jin Yim, Richard Strode, Jason M. Brand et al. · 2011 · 10 citations
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