Statistics
Publications
2
Citations
28
H-Index
2
Active since
2010
Affiliations
Micron (United States)(Current)
Ravikumar Adimula is an author at Micron (United States) specializing in materials engineering, package warpage control, and package warpage.
Publications per year
2010–2011
2
2
Effects of material properties on PoP top package warpage behaviors
Myung Jin Yim, Richard Strode, Ravikumar Adimula et al. · 2010 · 18 citations
Ultra thin PoP top package using compression mold: Its warpage control
Myung Jin Yim, Richard Strode, Jason M. Brand et al. · 2011 · 10 citations
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