Concepedia

Package Durability Testing

Package Durability Testing is a systematic evaluation method within packaging quality control that assesses the ability of a package to withstand physical, environmental, and logistical stresses during distribution and storage, distinguishing it from other testing methods by its focus on long-term performance and resistance to degradation under simulated real-world conditions.

4

Publications

142

Citations

24

Authors

10

Institutions

Publications per year

2017–2026

1

Parents

Publications

4

Design, manufacture and test for reliable 3D printed electronics packaging

T. Tilford, Stoyan Stoyanov, Jessica Braun et al. · Microelectronics Reliability · 2018 · 41 citations

, , +14

Experimental investigation on the degradation of BGA solder ball shear strength due to room temperature aging

Y Tsui, S. W. Ricky Lee, Xingjia Huang · 2003 · 37 citations

, , +17

Virtual qualification of moisture induced failures of advanced packages

M.A.J. van Gils, W.D. van Driel, G.Q. Zhang et al. · Microelectronics Reliability · 2007 · 37 citations

, , +13

Drop Impact Reliability Testing for Lead-Free and Leaded Soldered IC Packages

Desmond Y. R. Chong, Kellin Ng, J.Y.N. Tan et al. · 2005 · 27 citations

, , +17

1–4 of 4

Authors

24

  1. YT
    Y Tsui

    Hong Kong University of Science and Technology, Hong Kong SAR China

    1 publications · 37 citations

    1

    h-index

  2. JJ
    J.H.J. Janssen

    Philips (Netherlands), Netherlands

    1 publications · 37 citations

    1

    h-index

  3. JT
    J.Y.N. Tan

    Nanyang Technological University, Singapore

    1 publications · 27 citations

    1

    h-index

  4. MB
    Matthias Burgard

    University of Bayreuth, Germany

    1 publications · 41 citations

    1

    h-index

  5. PL
    P.T.H. Low

    Nanyang Technological University, Singapore

    1 publications · 27 citations

    1

    h-index

1–5 of 24

Institutions

10

  1. Nanyang Technological University

    Singapore, Singapore

    1 h-index

    3 publications

    81 citations

  2. University of Greenwich

    London, United Kingdom

    1 h-index

    3 publications

    123 citations

  3. Intel (United States)

    Santa Clara, United States

    1 h-index

    1 publications

    37 citations

  4. Applied Technologies (United States)

    Longmont, United States

    1 h-index

    2 publications

    74 citations

  5. Microsemi (United Kingdom)

    Caldicot, United Kingdom

    1 h-index

    1 publications

    41 citations

  6. NXP (Netherlands)

    Eindhoven, The Netherlands

    1 h-index

    4 publications

    148 citations

  7. Hong Kong University of Science and Technology

    Hong Kong, Hong Kong

    1 h-index

    3 publications

    111 citations

  8. Eindhoven University of Technology

    Eindhoven, The Netherlands

    1 h-index

    1 publications

    37 citations

1–8 of 10

Venues

  1. Microelectronics Reliability

    2 publications · 78 citations

    2

    h-index

1–1