Xingjia Huang

Publications

215

Citations

H-Index

2002

Active since

Affiliations

Hong Kong University of Science and Technology(Current)

Xingjia Huang is an author at Hong Kong University of Science and Technology specializing in engineering, electronic packaging, and mechanical engineering.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringMechanics Of MaterialsSolid MechanicsMechanical BehaviorMechanicsMicrostructureMaterial ScienceStructural Mechanics

Publications per year

2002–2015

Publications

Characterization and analysis on the solder ball shear testing conditions

Xingjia Huang, S. W. Ricky Lee, Chien Chun Yan et al. · 2002 · 74 citations

Engineering, Mechanical Behavior, Mechanics +12

Experimental investigation on the degradation of BGA solder ball shear strength due to room temperature aging

Y Tsui, S. W. Ricky Lee, Xingjia Huang · 2003 · 37 citations

Room Temperature, Engineering, Experimental Investigation +7

Analysis on solder ball shear testing conditions with a simple computational model

S. W. Ricky Lee, Xingjia Huang · Soldering and Surface Mount Technology · 2002 · 32 citations · Full text

Engineering, Mechanical Behavior, Mechanics +14

Assessment on the effects of electroless nickel plating on the reliability of solder ball attachment to the bond pads of PBGA substrate

S. W. Ricky Lee, Chien Chun Yan, Z. Karim et al. · 2002 · 21 citations

Engineering, Mechanical Engineering, Advanced Packaging (Semiconductors) +16

Detection of plated through hole defects in printed circuit board with X-ray

Xingjia Huang, Shengcong Zhu, Xuanyu Huang et al. · 2015 · 16 citations

Engineering, Hole Defects, Medical Imaging +12

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