Concepedia

Y Tsui

YT

2

Publications

66

Citations

2

H-Index

2002

Active since

Affiliations

Hong Kong University of Science and Technology(Current)

Y Tsui is an author at Hong Kong University of Science and Technology specializing in engineering, mechanical engineering, and electronic packaging.

Top concepts

Publications per year

2002–2003

2

Publications

2

Experimental investigation on the degradation of BGA solder ball shear strength due to room temperature aging

Y Tsui, S. W. Ricky Lee, Xingjia Huang · 2003 · 37 citations

, , +7

Effects of Room Temperature Storage Time on the Shear Strength of PBGA Solder Balls

S. W. Ricky Lee, Y Tsui, Xingjia Hunag et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 2002 · 29 citations

, , +9

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