Concepedia

Chien Chun Yan

CC

3

Publications

107

Citations

3

H-Index

2002

Active since

Affiliations

Hong Kong University of Science and Technology(Current)

Chien Chun Yan is an author at Hong Kong University of Science and Technology specializing in mechanical engineering, electronic packaging, and engineering.

Top concepts

Publications per year

2002–2003

3

Publications

3

Characterization and analysis on the solder ball shear testing conditions

Xingjia Huang, S. W. Ricky Lee, Chien Chun Yan et al. · 2002 · 74 citations

, , +12

Assessment on the effects of electroless nickel plating on the reliability of solder ball attachment to the bond pads of PBGA substrate

S. W. Ricky Lee, Chien Chun Yan, Z. Karim et al. · 2002 · 21 citations

, , +16

Experimental investigation on the progressive failure mechanism of solder balls during ball shear test

Xingjia Huang, S. W. Ricky Lee, Chien Chun Yan · 2003 · 12 citations

, , +14

Rows per page

1–3 of 3