H.J.L. Bressers

Numerical modeling of warpage induced in QFN array molding process

Daoguo Yang, K.M.B. Jansen, L.J. Ernst et al. · Microelectronics Reliability · 2007 · 46 citations

Engineering, Mechanical Engineering, Applied Physics +5

Mechanical Modeling and Characterization of the Curing Process of Underfill Materials

L.J. Ernst, C. van ‘t Hof, Daoguo Yang et al. · Journal of Electronic Packaging · 2002 · 43 citations

Engineering, Mechanical Engineering, Residual Stress +20

Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers

Daoguo Yang, K.M.B. Jansen, L.J. Ernst et al. · 2004 · 43 citations

Engineering, Mechanical Engineering, Thermoplastic Composite +18

Modeling of cure-induced warpage of plastic IC packages

Daoguo Yang, K.M.B. Jansen, L.J. Ernst et al. · 2004 · 43 citations

Engineering, Mechanical Engineering, Mechanics Of Materials +19

Cure, temperature and time dependent constitutive modeling of moulding compounds

K.M.B. Jansen, L. Wang, C. van ‘t Hof et al. · 2004 · 41 citations

Engineering, Mechanical Engineering, Encapsulation Materials +16