Concepedia

R.B.R. van Silfhout

RV

15

Publications

305

Citations

12

H-Index

2001

Active since

Affiliations

Philips (Netherlands)(Current)

Delft University of Technology

NXP (Netherlands)

Applied Technologies (United States)

Philips (Finland)

R.B.R. van Silfhout is an author at Philips (Netherlands) specializing in engineering, electronic packaging, and mechanical engineering.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringMaterial ScienceMicroelectronicsMechanics Of MaterialsApplied PhysicsSolid MechanicsMaterials EngineeringElectrical Engineering

Publications per year

2001–2008

15

Publications

15

Prediction of Delamination Related IC & Packaging Reliability Problems

W.D. van Driel, M.A.J. van Gils, R.B.R. van Silfhout et al. · Microelectronics Reliability · 2005 · 44 citations

Reliability, Reliability Engineering, Engineering +4

Virtual qualification of moisture induced failures of advanced packages

M.A.J. van Gils, W.D. van Driel, G.Q. Zhang et al. · Microelectronics Reliability · 2007 · 37 citations

Reliability, Reliability Engineering, Engineering +8

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

W.D. van Driel, C.J. Liu, G.Q. Zhang et al. · Microelectronics Reliability · 2004 · 33 citations

Materials Science, 3D Ic Architecture, Structural Integrity +11

Prediction of back-end process-induced wafer warpage and experimental verification

R.B.R. van Silfhout, W.D. van Driel, Y. Li et al. · 2003 · 21 citations

Defect Tolerance, Large Wafer Warpage, Experimental Verification +14

On wire failures in micro-electronic packages

W.D. van Driel, J.H.J. Janssen, R.B.R. van Silfhout et al. · 2004 · 21 citations

Engineering, Mechanical Engineering, Structural Optimization +21

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