Concepedia

C. Besset

CB

Statistics

Publications

6

Citations

221

H-Index

6

Active since

2003

Affiliations

STMicroelectronics (France)(Current)

Centre National de la Recherche Scientifique

Institut Supérieur de l'Électronique et du Numérique

Université Grenoble Alpes

Institut polytechnique de Grenoble

C. Besset is an author at STMicroelectronics (France) specializing in engineering, electrical engineering, and microelectronics.

Top concepts

EngineeringMicroelectronicsElectrical EngineeringApplied PhysicsElectronic PackagingComputer EngineeringNanoelectronicsMaterial ScienceMicrofabricationPlasticity

Publications per year

2003–2016

6

Publications

6

Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

S. Lhostis, A. Farcy, E. Deloffre et al. · 2016 · 90 citations

Engineering, Image Sensor, Cmos Image Sensor +16

MIM capacitance variation under electrical stress

C. Besset, S. Bruyère, S. Blonkowski et al. · Microelectronics Reliability · 2003 · 49 citations

Electrical Engineering, Engineering, Stress-induced Leakage Current +9

Impact of the gate-stack change from 40nm node SiON to 28nm High-K Metal Gate on the Hot-Carrier and Bias Temperature damage

A. Bravaix, Yoann Mamy Randriamihaja, V. Huard et al. · 2013 · 30 citations

Electrical Engineering, Engineering, Nanoelectronics +15

Off state incorporation into the 3 energy mode device lifetime modeling for advanced 40nm CMOS node

A. Bravaix, C. Guérin, D. Goguenheim et al. · 2010 · 27 citations

State Incorporation, Engineering, Energy Efficiency +16

Mass Transport-Induced Failure of Hybrid Bonding-Based Integration for Advanced Image Sensor Applications

S. Moreau, D. Bouchu, V. Balan et al. · 2016 · 14 citations

Engineering, Device Integration, Integrated Circuits +17

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