D. Bouchu

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

J. Jourdon, S. Lhostis, S. Moreau et al. · 2018 · 81 citations

Engineering, Device Integration, Integrated Circuits +24

Investigation on TSV impact on 65nm CMOS devices and circuits

H. Chaabouni, Maxime Rousseau, Philip R. LeDuc et al. · 2010 · 54 citations

Low-power Electronics, 3D Ic Architecture, Electrical Engineering +14

Enabling technologies for 3D chip stacking

Patrick Leduc, L. Di Cioccio, Barbara Charlet et al. · 2008 · 47 citations

Engineering, Computer Architecture, Interconnect (Integrated Circuits) +20

Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements

S. Moreau, J. Jourdon, S. Lhostis et al. · ECS Journal of Solid State Science and Technology · 2022 · 46 citations

Engineering, Reliability Achievements, Interconnect (Integrated Circuits) +16

Advanced Cu interconnects using air gaps

L.G. Gosset, A. Farcy, J. de Pontcharra et al. · Microelectronic Engineering · 2005 · 30 citations

3D Ic Architecture, Electrical Engineering, Engineering +7