Copper Ball Bonding Advances for Leading Edge Packaging

Abstract

The Graphic Processing Unit (GPU) represents the leading edge in assembly technology, eclipsing the Central Processing Unit (CPU) as the most challenging semiconductor device. This paper will explore ways in which GPUs are advancing the state-of -the-art in assembly with its low cost manufacturing requirements, high number of interconnects (now approaching 1,000 interconnects/device) and demanding electrical requirements. In addition to leading devices in the development of wire bond pitch below 50µm, the GPU has led the development of multi-tiered wire bonded structures. These packaging innovations have enabled the production of the industry's lowest cost, high-density packages, enabled by manufacturing flexibility in the wire bonding