C.D. Breach - Concepedia

Author

C.D. Breach

Also Known As

C. Breach, C. D Breach, C. D. Breach, C. D. Breacha, C.D Breach, C.D. Breach, CD Breach, Christopher Breach, Christopher D. Breach

Publications

940

Citations

H-Index

Concepts

All Affiliations

Kulicke & Soffa (Singapore)Nanyang Technological University Institute of Technical Education World Energy Council

About

C.D. Breach is an author at Kulicke & Soffa (Singapore) specializing in engineering, materials science, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	14	23	677
2	Applied Physics	10	12	380
3	Chemical Engineering	2	2	26
4	Education	1	1	12
5	Health Sciences	1	1	22

C.D. Breach

Publications

736

Citations

H-Index

Page 1

	Year	Citations
New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au4Al C.D. Breach, F. Wulff Microelectronics Reliability Materials ScienceInorganic ChemistryGold Ball BondsCrystal StructureEngineering	2004	108
Characterisation of intermetallic growth in copper and gold ball bonds on aluminium metallization F. Wulff, C.D. Breach, D. Stephan, EngineeringMechanical EngineeringCorrosionAluminium MetallizationCladding (Metalworking)	2005	91
What is the future of bonding wire? Will copper entirely replace gold? C.D. Breach Gold bulletin Ball BondingEngineeringCopper WireAdvanced Packaging (Semiconductors)Corrosion	2010	75
Corrosion Study and Intermetallics Formation in Gold and Copper Wire Bonding in Microelectronics Packaging C.S. Goh, Wee Ling Chong, Teck Kheng Lee, Crystals Sodium ChlorideEngineeringCorrosion InhibitionCorrosionElectronic Packaging	2013	70
Cyclic loading as an extended nanoindentation technique T. Saraswati, Thirumany Sritharan, Subodh G. Mhaisalkar, Materials Science and Engineering A Materials ScienceEngineeringMicrofabricationSolid MechanicsNanometrology	2006	49
High Temperature Storage (HTS) Performance of Copper Ball Bonding Wires Saraswati Saraswati, Ei Phyu Phyu Theint, D. Stephan, Ball BondingEngineeringSevere Plastic DeformationMechanical EngineeringInterconnect (Integrated Circuits)	2006	34
Oxidation of bulk Au–Al intermetallics Chen Xu, C.D. Breach, Thirumany Sritharan, Thin Solid Films Materials ScienceMaterials EngineeringEngineeringCorrosionOxidation Resistance	2004	26
Crystallographic texture of drawn gold bonding wires using electron backscattered diffraction (EBSD) F. Wulff, C.D. Breach, K. Dittmer Journal of Materials Science Letters	2003	23
Physical ageing of wheat flour-based confectionery wafers S. Livings, C.D. Breach, Athene M. Donald, Carbohydrate Polymers Food ChemistryShelf LifeAgricultural EconomicsGrain StorageGrain Quality	1997	22
Intermetallic growth in gold ball bonds aged at 175°C: comparison between two 4N wires of different chemistry C.D. Breach, F. Wulff Gold bulletin EngineeringDifferent ChemistryCrystal Growth TechnologySolid-state ChemistryGold Wires	2009	21

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