F. Wulff

New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au4Al

C.D. Breach, F. Wulff · Microelectronics Reliability · 2004 · 110 citations

Natural Sciences, Materials Engineering, Materials Science +13

Characterisation of intermetallic growth in copper and gold ball bonds on aluminium metallization

F. Wulff, C.D. Breach, D. Stephan et al. · 2005 · 91 citations

Natural Sciences, Materials Engineering, Materials Science +15

Cyclic loading as an extended nanoindentation technique

T. Saraswati, Thirumany Sritharan, Subodh G. Mhaisalkar et al. · Materials Science and Engineering A · 2006 · 53 citations

Natural Sciences, Materials Engineering, Materials Science +12

High Temperature Storage (HTS) Performance of Copper Ball Bonding Wires

Saraswati Saraswati, Ei Phyu Phyu Theint, D. Stephan et al. · 2006 · 34 citations

Natural Sciences, Materials Engineering, Materials Science +17

Strain rate sensitivity and Hall–Petch behavior of ultrafine-grained gold wires

Y.H. Chew, Christian Wong, F. Wulff et al. · Thin Solid Films · 2007 · 34 citations

Natural Sciences, Materials Science, Physics +16