Teck Kheng Lee

Corrosion Study and Intermetallics Formation in Gold and Copper Wire Bonding in Microelectronics Packaging

C.S. Goh, Wee Ling Chong, Teck Kheng Lee et al. · Crystals · 2013 · 72 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Effects of Sterilization Cycles on PEEK for Medical Device Application

Amit Kumar, Wai Teng Yap, Soo Leong Foo et al. · Bioengineering · 2018 · 48 citations · Full text

Engineering, Materials Engineering, Materials Science +16

Interfacial microstructures and kinetics of Au/SnAgCu

Teck Kheng Lee, Sam Zhang, C.C. Wong et al. · Thin Solid Films · 2005 · 34 citations

Natural Sciences, Materials Engineering, Materials Science +12

A Novel and Low-Cost Cloud-Enabled IoT Integration for Sustainable Remote Intravenous Therapy Management

Chiang Liang Kok, Chee Kit Ho, Teck Kheng Lee et al. · Electronics · 2024 · 26 citations · Full text

Computing, Cloud Computing, Health Informatics +17

A Novel Low-Cost Capacitance Sensor Solution for Real-Time Bubble Monitoring in Medical Infusion Devices

Chiang Liang Kok, Yuwei Dai, Teck Kheng Lee et al. · Electronics · 2024 · 18 citations · Full text

Engineering, Bioengineering, Biomedical Engineering +12