Jin Onuki

Reliability of thick Al wire bonds in IGBT modules for traction motor drives

Jin Onuki, Masahiro Koizumi, Masaki Suwa · IEEE Transactions on Advanced Packaging · 2000 · 90 citations

Natural Sciences, Materials Engineering, Materials Science +17

Investigation of the Reliability of Copper Ball Bonds to Aluminum Electrodes

Jin Onuki, Masahiro Koizumi, I. Araki · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1987 · 68 citations

Natural Sciences, Materials Engineering, Materials Science +17

Influence of P Content in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Zn Solder and Plated Au/Ni-P Alloy Film

Yasunori Chonan, Takao Komiyama, Jin Onuki et al. · MATERIALS TRANSACTIONS · 2002 · 40 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +15

Texture and Grain Size Investigation in the Copper Plated Through-Silicon via for Three-Dimensional Chip Stacking Using Electron Backscattering Diffraction

Hiroyuki Kadota, Ryuichi Kanno, Masahiko Ito et al. · Electrochemical and Solid-State Letters · 2011 · 37 citations

Engineering, Materials Engineering, Materials Science +17

Development of A New High-Frequency, High-Peak Current Power Source for High Constricted Arc Formation

Jin Onuki, Yoshisa Anazawa, Masayasu Nihei et al. · Japanese Journal of Applied Physics · 2002 · 34 citations

Engineering, Electrical Engineering, Metallurgy +9