IEEE Transactions on Components Packaging and Manufacturing Technology · 2020 · 12 citations · 21 references
EngineeringComputer EngineeringComputer SystemsEmbedded SystemsPackaging DesignPerformance-based DesignChip PackagingPackage DesignPackaging EngineeringAdvanced PackagingPackage ParasiticsPerformance Trade-offsPlatform PackagingSystem Performance Modeling
In this letter, we propose a novel signaling figure of merit (s-FoM) for comparison of signaling schemes across different packaging technologies. It considers all the essential metrics that affect system performance and efficiency and combines them in a simple, easily quantifiable manner. These include energy per bit, data-bandwidth per unit shoreline, latency, length of the link, and real-estate overhead. This tool captures all the performance trade-offs and enables a fair comparison across different packaging platforms and integration schemes.
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