Concepedia

SivaChandra Jangam

SJ

9

Publications

347

Citations

9

H-Index

2017

Active since

Affiliations

University of California, Los Angeles(Current)

SivaChandra Jangam is an author at University of California, Los Angeles specializing in electronic packaging, advanced packaging, and engineering.

Top concepts

EngineeringAdvanced PackagingElectronic PackagingMicroelectronicsMicrofabricationElectrical EngineeringIntegrated CircuitsComputer EngineeringThree-dimensional Heterogeneous IntegrationApplied Physics

Publications per year

2017–2021

9

Publications

9

Heterogeneous Integration at Fine Pitch (≤ 10 µm) Using Thermal Compression Bonding

Adeel Bajwa, SivaChandra Jangam, Saptadeep Pal et al. · 2017 · 88 citations

Engineering, Mechanical Engineering, Thermal Compression Bonding +21

Silicon-Interconnect Fabric for Fine-Pitch (≤10 μm) Heterogeneous Integration

SivaChandra Jangam, Subramanian S. Iyer · IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 48 citations

Engineering, Device Integration, Silicon-interconnect Fabric +19

Silicon interconnect fabric: A versatile heterogeneous integration platform for AI systems

Subramanian S. Iyer, SivaChandra Jangam, Boris Vaisband · IBM Journal of Research and Development · 2019 · 45 citations

Artificial Intelligence, Engineering, Device Integration +27

Latency, Bandwidth and Power Benefits of the SuperCHIPS Integration Scheme

SivaChandra Jangam, Saptadeep Pal, Adeel Bajwa et al. · 2017 · 41 citations

Engineering, Integration Scheme, Computer Architecture +23

Electrical Characterization of High Performance Fine Pitch Interconnects in Silicon-Interconnect Fabric

SivaChandra Jangam, Adeel Ahmed Bajwa, Kannan K Thankkappan et al. · 2018 · 41 citations

Engineering, Device Integration, Computer Architecture +24

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