Concepedia

Boris Vaisband

BV

16

Publications

259

Citations

12

H-Index

2014

Active since

Affiliations

University of Rochester(Current)

McGill University

University of California, Los Angeles

Drexel University

Samueli Institute

Boris Vaisband is an author at University of Rochester specializing in electrical engineering, engineering, and electronic packaging.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringIntegrated CircuitsComputer EngineeringAdvanced PackagingMicrofabricationThree-dimensional Heterogeneous Integration3D Integration

Publications per year

2014–2023

16

Publications

16

Silicon interconnect fabric: A versatile heterogeneous integration platform for AI systems

Subramanian S. Iyer, SivaChandra Jangam, Boris Vaisband · IBM Journal of Research and Development · 2019 · 45 citations

Artificial Intelligence, Engineering, Device Integration +27

Hexagonal TSV Bundle Topology for 3-D ICs

Boris Vaisband, Eby G. Friedman · IEEE Transactions on Circuits & Systems II Express Briefs · 2016 · 26 citations

Engineering, Computer-aided Design, Integrated Circuits +22

Demonstration of a Heterogeneously Integrated System-on-Wafer (SoW) Assembly

Adeel Bajwa, SivaChandra Jangam, Saptadeep Pal et al. · 2018 · 21 citations

Materials Science, Advanced Packaging, Electrical Engineering +15

Electrical and Thermal Models of CNT TSV and Graphite Interface

Boris Vaisband, Ange A. Maurice, Chong Wei Tan et al. · IEEE Transactions on Electron Devices · 2018 · 16 citations

Engineering, Thermal Conductivity, Graphene Nanomeshes +20

3-D ICs as a Platform for Heterogeneous SystemsIntegration

Boris Vaisband · UR Research (University of Rochester) · 2017 · 15 citations · Full text

Heterogeneous Computing, Engineering, Computer Architecture +25

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