Concepedia

Platform Packaging

Platform Packaging is a systematic framework within vehicle design that integrates and standardizes the spatial, structural, and functional arrangement of core chassis components across multiple vehicle variants to optimize packaging efficiency, manufacturability, and performance scalability.

5

Publications

63

Citations

27

Authors

11

Institutions

Publications per year

2017–2026

2

Parents

Publications

5

100 Gbps Indoor Access and 4.8 Gbps Outdoor Point-to-Point LiFi Transmission Systems Using Laser-Based Light Sources

Cheng Chen, Sovan Das, Stefan Videv et al. · Journal of Lightwave Technology · 2024 · 27 citations · Full text

, , +16

Designing biological fluid inspired molecularly crowded ionic liquid media as a sustainable packaging platform for cytochrome <i>c</i>

Kavya Bhakuni, Meena Bisht, Pannuru Venkatesu et al. · Chemical Communications · 2019 · 20 citations

, , +5

A PCB Packaging Platform Enabling 100+ Gbaud Optoelectronic Device Testing

Aaron Maharry, Luis A. Valenzuela, James F. Buckwalter et al. · 2021 · 14 citations

, , +14

A Signaling Figure of Merit (s-FoM) for Advanced Packaging

SivaChandra Jangam, Subramanian S. Iyer · IEEE Transactions on Components Packaging and Manufacturing Technology · 2020 · 12 citations

, , +11

Demonstration of high quality and low loss millimeter wave passives on embedded wafer level packaging platform (EMWLP)

Ying Ying Lim, Srinivasa Rao Vempati, Nandar Su et al. · 2009 · 11 citations

, , +16

1–5 of 5

Authors

27

  1. NS
    Nandar Su

    Institute of Microelectronics, Singapore

    1 publications · 11 citations

    1

    h-index

  2. WL
    W.S. Lee

    Kwangwoon University, South Korea

    1 publications · 10 citations

    1

    h-index

  3. MB
    Meena Bisht

    University of Delhi, India

    1 publications · 20 citations

    1

    h-index

  4. GS
    Gaurav Sharma

    Shoolini University, India

    1 publications · 11 citations

    1

    h-index

  5. JH
    John H. Lau

    Industrial Technology Research Institute, Taiwan

    1 publications · 11 citations

    1

    h-index

1–5 of 27

Institutions

11

  1. Samsung (South Korea)

    Seoul, South Korea

    1 h-index

    3 publications

    30 citations

  2. Institute of Microelectronics

    Singapore, Singapore

    1 h-index

    7 publications

    77 citations

  3. Material Sciences (United States)

    Burr Ridge, United States

    1 h-index

    1 publications

    20 citations

  4. University of Aveiro

    Aveiro, Portugal

    1 h-index

    1 publications

    20 citations

  5. Jain University

    Bengaluru, India

    1 h-index

    1 publications

    20 citations

  6. Kwangwoon University

    Seoul, South Korea

    1 h-index

    3 publications

    30 citations

  7. Korea Advanced Institute of Science and Technology

    Daejeon, South Korea

    1 h-index

    2 publications

    20 citations

  8. Agency for Science, Technology and Research

    Singapore, Singapore

    1 h-index

    9 publications

    99 citations

1–8 of 11

Venues

  1. Electronics Letters

    2 publications · 20 citations

    2

    h-index

  2. 1

    h-index

  3. Chemical Communications

    ChemComm · 1 publications · 20 citations

    1

    h-index

  4. Journal of Lightwave Technology

    1 publications · 27 citations

1–4