Concepedia

Package Parasitics

Package Parasitics is a distributed electrical phenomenon inherent to integrated circuit packaging that comprises unintended inductive, capacitive, and resistive couplings, which collectively degrade signal integrity by introducing impedance discontinuities, crosstalk, and propagation delay variations in high-speed digital systems.

269

Publications

7.8K

Citations

951

Authors

249

Institutions

Publications per year

2017–2026

29

Parents

Publications

269

Effects of Parasitic Parameters on EMI Filter Performance

S. Wang, F.C. Lee, D.Y. Chen et al. · IEEE Transactions on Power Electronics · 2004 · 302 citations

, , +16

A Convex Programming Approach for Generating Guaranteed Passive Approximations to Tabulated Frequency-Data

C.P. Coelho, Joel Phillips, L. Miguel Silveira · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2004 · 168 citations

, , +15

Extraction of parasitics within wire-bond IGBT modules

Kexin Xing, F.C. Lee, Dushan Boroyevich · 2002 · 137 citations

, , +16

A 0.5-8.5 GHz fully differential CMOS distributed amplifier

Hee-Tae Ahn, D.J. Allstot · IEEE Journal of Solid-State Circuits · 2002 · 134 citations

, , +16

Package-Level Integrated Antennas Based on LTCC Technology

Sang‐Hyuk Wi, Yongbin Sun, Inyong Song et al. · IEEE Transactions on Antennas and Propagation · 2006 · 112 citations

, , +16

1–5 of 269

Authors

951

  1. MS
    Madhavan Swaminathan

    Georgia Institute of Technology, United States

    10 publications · 227 citations

    10

    h-index

  2. FW
    Fred Wang

    University of Tennessee at Knoxville, United States

    7 publications · 223 citations

    7

    h-index

  3. JP
    J.L. Prince

    University of Arizona, United States

    6 publications · 180 citations

    6

    h-index

  4. JF
    Jiayuan Fang

    Binghamton University, United States

    5 publications · 97 citations

    5

    h-index

  5. LM
    Leon M. Tolbert

    University of Tennessee at Knoxville, United States

    5 publications · 185 citations

    5

    h-index

1–5 of 951

Institutions

249

  1. Georgia Institute of Technology

    Atlanta, United States

    13 h-index

    67 publications

    1.4K citations

  2. Intel (United States)

    Santa Clara, United States

    10 h-index

    48 publications

    1.3K citations

  3. IBM (United States)

    Armonk, United States

    10 h-index

    32 publications

    655 citations

  4. Virginia Tech

    Blacksburg, United States

    9 h-index

    36 publications

    3.2K citations

  5. University of Illinois Urbana-Champaign

    Urbana, United States

    7 h-index

    16 publications

    287 citations

  6. University of Arizona

    Tucson, United States

    7 h-index

    18 publications

    525 citations

  7. Advanced Semiconductor Engineering (Taiwan)

    Kaohsiung, Taiwan

    6 h-index

    17 publications

    245 citations

  8. Centre National de la Recherche Scientifique

    Paris, France

    6 h-index

    26 publications

    736 citations

1–8 of 249

Venues

  1. 15

    h-index

  2. IEEE Transactions on Advanced Packaging

    9 publications · 175 citations

    9

    h-index

  3. IEEE Transactions on Power Electronics

    9 publications · 624 citations

    9

    h-index

  4. 7

    h-index

  5. Microelectronics Reliability

    7 publications · 136 citations

    7

    h-index

1–5