Signal Integrity

Signal Integrity is a property of electrical signals in VLSI interconnect and packaging that denotes their ability to propagate and be interpreted correctly at their destinations without unacceptable degradation, distortion, noise, or timing errors caused by parasitics, coupling, and electromagnetic interference.

501

Publications

16.1K

Citations

1.5K

Authors

388

Institutions

Publications per year

2017–2026

Parents

Vlsi Design

Children

Bit Error RateChannel CharacterizationCrosstalkCrosstalk CancellationElectromagnetic InterferenceEqualizationEye DiagramsGround BounceHigh-speed I/o SignalingInter-symbol Interference

Publications

501

Stability, Causality, and Passivity in Electrical Interconnect Models

Piero Triverio, S. Grivet‐Talocia, M. Nakhla et al. · IEEE Transactions on Advanced Packaging · 2007 · 301 citations · Full text

Engineering, Electrical Engineering, Systems Engineering +14

Low-swing on-chip signaling techniques: effectiveness and robustness

H. Zhang, Varghese George, Jan M. Rabaey · IEEE Transactions on Very Large Scale Integration (VLSI) Systems · 2000 · 293 citations

Engineering, Computer Engineering, Electrical Engineering +15

Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions

Jun Fan, Xiaoning Ye, Jingook Kim et al. · IEEE Transactions on Electromagnetic Compatibility · 2010 · 292 citations

Engineering, Computer Engineering, Electrical Engineering +17

Overview of Signal Integrity and EMC Design Technologies on PCB: Fundamentals and Latest Progress

Tzong‐Lin Wu, Frits Buesink, Flavio Canavero · IEEE Transactions on Electromagnetic Compatibility · 2013 · 247 citations · Full text

Engineering, Computational Engineering, Electrical Engineering +17

An Embedded Common-Mode Suppression Filter for GHz Differential Signals Using Periodic Defected Ground Plane

Wei-Tzong Liu, Chung-Hao Tsai, Tzu-Wei Han et al. · IEEE Microwave and Wireless Components Letters · 2008 · 218 citations

Engineering, Electrical Engineering, Analog Electronics +16

1–5 of 501

Authors

1.5K

JK
Joungho Kim
Korea Advanced Institute of Science and Technology, South Korea
22 publications · 741 citations
15
h-index
MS
Madhavan Swaminathan
Georgia Institute of Technology, United States
15 publications · 460 citations
11
h-index
TW
Tzong‐Lin Wu
National Taiwan University, Taiwan
10 publications · 1K citations
10
h-index
CS
Christian Schuster
Hamburg University of Technology, Germany
9 publications · 277 citations
9
h-index
JF
Jun Fan
Missouri University of Science and Technology, United States
9 publications · 521 citations
9
h-index

1–5 of 1.5K

Institutions

388

1–8 of 388

Venues

IEEE Transactions on Electromagnetic Compatibility
40 publications · 2.6K citations
25
h-index
IEEE Transactions on Components Packaging and Manufacturing Technology
22 publications · 577 citations
17
h-index
IEEE Transactions on Advanced Packaging
19 publications · 1.2K citations
16
h-index
IEEE Transactions on Microwave Theory and Techniques
13 publications · 754 citations
13
h-index
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
12 publications · 638 citations
12
h-index

1–5