Christian Schuster

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

John Knickerbocker, Paul Andry, L.P. Buchwalter et al. · IBM Journal of Research and Development · 2005 · 236 citations

Terabus: Terabit/Second-Class Card-Level Optical Interconnect Technologies

Laurent Schares, J. A. Kash, Fuad E. Doany et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2006 · 226 citations

Organic Cards, Optical Materials, Optical Technologies +22

Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz

Renato Rímolo-Donadío, Xiaoxiong Gu, Young Kwark et al. · IEEE Transactions on Microwave Theory and Techniques · 2009 · 174 citations

Engineering, Physics-based Via, Structural Optimization +22

120-Gb/s VCSEL-Based Parallel-Optical Interconnect and Custom 120-Gb/s Testing Station

D.M. Kuchta, Young Kwark, Christian Schuster et al. · Journal of Lightwave Technology · 2004 · 96 citations

Free-space Optical Network, Photonics, Electrical Engineering +15

Parasitic modes on printed circuit boards and their effects on EMC and signal integrity

Christian Schuster, Wolf Fïchtner · IEEE Transactions on Electromagnetic Compatibility · 2001 · 91 citations

Engineering, Surface Wave, Parasitic Modes +17