Joungho Kim

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Joohee Kim, Jun So Pak, Jonghyun Cho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 487 citations

Engineering, Electrical Engineering, Circuit Theory +16

Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System

Jiseong Kim, Jonghoon Kim, Sunkyu Kong et al. · Proceedings of the IEEE · 2013 · 453 citations

Engineering, Electrical Engineering, Physics +17

Power distribution networks for system-on-package: status and challenges

Madhavan Swaminathan, Joungho Kim, István Novák et al. · IEEE Transactions on Advanced Packaging · 2004 · 262 citations

Engineering, Computer Engineering, Electrical Engineering +17

Coil Design and Measurements of Automotive Magnetic Resonant Wireless Charging System for High-Efficiency and Low Magnetic Field Leakage

Hongseok Kim, Chiuk Song, Dong-Hyun Kim et al. · IEEE Transactions on Microwave Theory and Techniques · 2016 · 214 citations

Engineering, Automotive Engineering, Electrical Engineering +17

Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Er‐Ping Li, Xing‐Chang Wei, A.C. Cangellaris et al. · IEEE Transactions on Electromagnetic Compatibility · 2010 · 206 citations

Engineering, Computer Engineering, Electrical Engineering +17