Influence of SnO2 Nanoparticles Addition on Microstructure, Thermal Analysis, and Interfacial IMC Growth of Sn1.0Ag0.7Cu Solder

Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints

K.S. Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Journal of Alloys and Compounds · 2003 · 610 citations

Natural Sciences, Materials Engineering, Materials Science +11

Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications

Iver E. Anderson · Journal of Materials Science Materials in Electronics · 2006 · 209 citations

Natural Sciences, Materials Engineering, Materials Science +14

Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder

L.C. Tsao, Shih‐Ying Chang, Chih-Chen Lee et al. · Materials & Design (1980-2015) · 2010 · 208 citations

Natural Sciences, Materials Engineering, Materials Science +16

Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition

Yi‐Shao Lai, Ping‐Feng Yang, Chang-Lin Yeh · Microelectronics Reliability · 2005 · 180 citations

Engineering, Computer Engineering, Packaging Design +14

The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints

Guang Zeng, Stuart D. McDonald, Qinfen Gu et al. · Acta Materialia · 2014 · 168 citations

Natural Sciences, Materials Engineering, Materials Science +17