The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints - Concepedia

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The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints

162

Citations

69

References

2014

Year

Guang Zeng, Stuart D. McDonald, Qinfen Gu, Yasuko Terada, Kentaro Uesugi, Hideyuki Yasuda, Kazuhiro Nogita

Acta Materialia

Materials ScienceMaterials EngineeringEngineeringZn AdditionsMechanical EngineeringPhase TransformationsSn–0.7cu/cu Solder JointsAlloy PhaseMicrostructureMetal Processing

References

	Year	Citations

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