Applied Physics Letters · 2006 · 28 citations · 6 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsDefect ModelingDevice SimulationSemiconductor DefectsSemiconductor Device MaterialsSemiconductor InterfacesSilicon MaterialsCrystalline SiliconDefect DiffusionDiffusion In SemiconductorsImplantation-induced Defect FormationInterstitialsSiliconSilicon DefectsTransient Enhanced Diffusion
The authors have studied the interactions between implant defects and phosphorus diffusion in crystalline silicon. Defect engineering enables ultrashallow n+∕p junction formation using phosphorus, carbon, and germanium coimplants, and spike anneal. Their experimental data suggest that the positioning of a preamorphized layer using germanium implants plays an important role in phosphorus diffusion. They find that extending the overlap of germanium preamorphization and carbon profiles results in greater reduction of phosphorus transient-enhanced diffusion by trapping more excess interstitials. This conclusion is consistent with the end-of-range defects calculated by Monte Carlo simulation and annealed carbon profiles.
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Effect of fluorine on the diffusion of boron in ion implanted Si
Daniel F. Downey, Judy W. Chow, E. Ishida et al. · Applied Physics Letters · 1998 · 110 citations · Full text
Natural Sciences, Materials Engineering, Materials Science +17