Analysis of electromigration induced early failures in Cu interconnects for 45nm node

Relationship between interfacial adhesion and electromigration in Cu metallization

Michael Lane, E. Liniger, J. R. Lloyd · Journal of Applied Physics · 2003 · 294 citations

Natural Sciences, Electrical Engineering, Materials Science +13

General model for mechanical stress evolution during electromigration

Yu. V. Zhitnikov, L. Borucki, C.-L. Liu · Journal of Applied Physics · 1999 · 165 citations

Natural Sciences, Materials Engineering, Materials Science +17

Evidence of grain-boundary versus interface diffusion in electromigration experiments in copper damascene interconnects

L. Arnaud, T. Berger, G. Reimbold · Journal of Applied Physics · 2002 · 79 citations

Engineering, Electrical Engineering, Materials Science +13

Effect of current direction on the lifetime of different levels of Cu dual-damascene metallization

Chee Lip Gan, Carl V. Thompson, K. L. Pey et al. · Applied Physics Letters · 2001 · 76 citations

Engineering, Electrical Engineering, Materials Science +17

Microstructural characterization of inlaid copper interconnect lines

Paul R. Besser, Ehrenfried Zschech, Werner Blum et al. · Journal of Electronic Materials · 2001 · 70 citations

Engineering, Electrical Engineering, Materials Engineering +14