Transport and Tensile Properties of Compression-Molded Wheat Gluten Films

Abstract

Mechanical and transport properties were assessed on wheat gluten films with a glycerol content of 25-40%, prepared by compression molding for 5-15 min at temperatures between 90 and 130 degrees C. Effects of storing the films up to 24 days, in 0 and 50% relative humidity (RH), were assessed by tensile measurements. The films were analyzed with respect to methanol zero-concentration diffusivity, oxygen permeability (OP), water vapor permeability (WVP), Cobb60 and sodium dodecyl sulfate (SDS) solubility coupled with sonication. The SDS solubility and methanol diffusivity were lower at the higher molding temperature. Higher glycerol content resulted in higher OP (90-95% RH), WVP, and Cobb60 values, due to the plasticizing and hygroscopic effects. Higher glycerol contents gave a lower fracture stress, lower Young's modulus, lower fracture strain, and less strain hardening. The mold time had less effect on the mechanical properties than mold temperature and glycerol content. The fracture stress and Young's modulus increased and the fracture strain decreased with decreasing moisture content.