High-temperature wire sweep characteristics of semiconductor package for variable loop-height wirebonding technology

Microelectronics reliability

J. Wayne Meredith · 2003 · 296 citations

Reliability, Reliability Goals, Electrical Engineering +15

A three-dimensional modeling of wire sweep incorporating resin cure

Jichuan Wu, A.A.O. Tay, K. S. Yeo et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1998 · 33 citations

Transfer Molding, Electrical Engineering, Engineering +14

A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments

Sejin Han, K. K. Wang · Journal of Electronic Packaging · 1995 · 29 citations

Transfer Molding, Engineering, Mechanical Engineering +17

Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation

Spring H. Han, K. K. Wang, D. L. Crouthamel · Journal of Electronic Packaging · 1997 · 22 citations

Engineering, Encapsulation Process, Mechanical Engineering +19

Improving the deflection of wire bonds in stacked chip scale package (CSP)

Yasuhiro Yao, T.Y. Lin, K.H. Chua · Microelectronics Reliability · 2003 · 20 citations

Materials Science, Electrical Engineering, Chip-scale Package +10