Concepedia

Yasuhiro Yao

YY

Statistics

Publications

4

Citations

135

H-Index

4

Active since

2003

Affiliations

Institute of Microelectronics(Current)

Yasuhiro Yao is an author at Institute of Microelectronics specializing in electronic packaging, materials science, and mechanical engineering.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMechanical EngineeringApplied PhysicsPolymer ScienceFailure AnalysisMicroelectronicsMicrofabricationAdvanced Packaging

Publications per year

2003–2014

4

Publications

4

Surface grinding of carbon fiber reinforced plastic (CFRP) with an internal coolant supplied through grinding wheel

Hiroyuki SASAHARA, Tomoko Kikuma, Rei Koyasu et al. · Precision Engineering · 2014 · 83 citations

Grinding Wheel, Surface Grinding, Fibre-reinforced Plastic +2

Improving the deflection of wire bonds in stacked chip scale package (CSP)

Yasuhiro Yao, T.Y. Lin, K.H. Chua · Microelectronics Reliability · 2003 · 20 citations

Materials Science, Electrical Engineering, Chip-scale Package +10

Failure Analysis of Full Delamination on the Stacked Die Leaded Packages

T.Y. Lin, Z.P. Xiong, Yasuhiro Yao et al. · Journal of Electronic Packaging · 2003 · 19 citations

Engineering, Mechanical Engineering, Reliability Engineering +16

Development of the green plastic encapsulation for high density wirebonded leaded packages

T.Y. Lin, Chen Fang, Yasuhiro Yao et al. · Microelectronics Reliability · 2003 · 13 citations

Materials Science, High Density, Engineering +6

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