Concepedia

Z.P. Xiong

ZX

Statistics

Publications

3

Citations

64

H-Index

3

Active since

2003

Affiliations

Institute of Microelectronics(Current)

Z.P. Xiong is an author at Institute of Microelectronics specializing in electronic packaging, engineering, and mechanical engineering.

Top concepts

Publications per year

2003–2007

3

Publications

3

Study on Factors Affecting Underfill Flow and Underfill Voids in a Large-die Flip Chip Ball Grid Array (FCBGA) Package

Paul S. Ho, Z.P. Xiong, K.H. Chua · 2007 · 34 citations

, , +13

Failure Analysis of Full Delamination on the Stacked Die Leaded Packages

T.Y. Lin, Z.P. Xiong, Yasuhiro Yao et al. · Journal of Electronic Packaging · 2003 · 19 citations

, , +16

Bump non-wet issue in large-die flip chip package with eutectic Sn/Pb solder bump and SOP substrate pad

Z.P. Xiong, Ho Pei Sze, K.H. Chua · 2005 · 11 citations

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