Concepedia

T.Y. Lin

TL

18

Publications

547

Citations

14

H-Index

1978

Active since

Affiliations

National University of Singapore(Current)

Singapore Science Park

Institute of Microelectronics

National Yang Ming Chiao Tung University

T.Y. Lin is an author at National University of Singapore specializing in engineering, materials science, and electronic packaging.

Top concepts

EngineeringElectronic PackagingMaterial ScienceMechanical EngineeringMechanics Of MaterialsHeat TransferThermal EngineeringPlasticityElectrical EngineeringMicroelectronics

Publications per year

1978–2017

18

Publications

18

Uneven gas diffusion layer intrusion in gas channel arrays of proton exchange membrane fuel cell and its effects on flow distribution

Satish G. Kandlikar, Zijie Lu, T.Y. Lin et al. · Journal of Power Sources · 2009 · 106 citations

Proton-exchange Membrane, Gas Channel Arrays, Flow Distribution +1

Heat transfer characteristics of water flow in microtubes

Chenyu Yang, T.Y. Lin · Experimental Thermal and Fluid Science · 2007 · 66 citations

Heat Transfer Process, Engineering, Heat Transfer Enhancement +6

Influence of temperature, humidity, and defect location on delamination in plastic IC packages

A.A.O. Tay, T.Y. Lin · IEEE Transactions on Components and Packaging Technologies · 1999 · 60 citations

Engineering, Mechanical Engineering, Mechanics Of Materials +21

Moisture-induced interfacial delamination growth in plastic IC packages during solder reflow

A.A.O. Tay, T.Y. Lin · 2002 · 39 citations

Engineering, Thermal Processing, Mechanics Of Materials +18

Effects of moisture and delamination on cracking of plastic IC packages during solder reflow

A.A.O. Tay, T.Y. Lin · 2002 · 36 citations

Engineering, Mechanical Engineering, Vapor Pressure +19

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