D. L. Crouthamel

Residual Stress Development in the Injection Molding of Polymers

А. I. Isayev, D. L. Crouthamel · Polymer-Plastics Technology and Engineering · 1984 · 114 citations

Engineering, Mechanical Engineering, Residual-stress Development +16

Thermomechanical properties of 1C molding compounds

H. E. Bair, D. J. Boyle, Jason T. Ryan et al. · Polymer Engineering and Science · 1990 · 50 citations

Transfer Molding, Thermomechanical Properties, Engineering +18

The impact of moisture in mold compound preforms on the warpage of PBGA packages

T.Y. Lin, B. Njoman, D. L. Crouthamel et al. · Microelectronics Reliability · 2003 · 28 citations

Advanced Packaging, Materials Science, Food Packaging +7

Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation

Spring H. Han, K. K. Wang, D. L. Crouthamel · Journal of Electronic Packaging · 1997 · 22 citations

Engineering, Encapsulation Process, Mechanical Engineering +19

Stability of Flip-Chip Interconnects Assembled with Al/Ni(V)/Cu-UBM and Eutectic Pb-Sn Solder During Exposure to High-Temperature Storage

John Osenbach, A. Amin, M. Bachman et al. · Journal of Electronic Materials · 2008 · 13 citations

Materials Engineering, Materials Science, Electrical Engineering +12